Copper (II) oxide: Difference between revisions
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===Synthesis=== | ===Synthesis=== | ||
Heating [[copper]] to 300°C in air produces CuO. | |||
# Gather 100ubm of fine [[copper]] grains | # Gather 100ubm of fine [[copper]] grains | ||
# Heat over a flame in a shallow thin-walled crucible | # Heat over a flame in a shallow thin-walled crucible | ||
Latest revision as of 11:54, 23 March 2020
| Chemical formula | CuO |
|---|---|
| OTP appearance | black powder |
| Molar Mass(g/mol) | 79.545 |
| Density(g/cc) | 6.315 |
| Melting Point(°C) | 1326 |
| Boiling Point(°C) | 2000 |
| Solubility in water(g/L) | 0 |
| NFPA 704 |  0
2
1
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Uses
Primary
Other
- Catalyst
- Precursor to cuperammonium for the production of rayon
- Glass polishing
- Component of copper-aluminum thermite
- P-type semiconductor
Natural occurrence
- Occurs naturally as the rare mineral tenorite
Hazards
Production
Extraction
Synthesis
Heating copper to 300°C in air produces CuO.
- Gather 100ubm of fine copper grains
- Heat over a flame in a shallow thin-walled crucible
- Repeat
- Stir the grains over a steady, strong heat until they become a uniform dark grey or black
- NB: the stirring is vital, or the copper oxide "crust" will prevent air from reaching the inner mass of copper, and solidify the entire mass into a single lump which will be hard to manipulate
- Grind filings thoroughly in a mortar and pestle
- NB: this is to crack off any CuO "skin", exposing new copper on the surface of the grain
- Weigh the filings.
- Stir the grains over a steady, strong heat until they become a uniform dark grey or black
- Until filings weigh close to 125ubm (Cu: ~64g/mol, CuO ~80g/mol
- The filings are predominantly copper (II) oxide
- As an example, 325mesh (44μm) copper powder will accumulate 10% weight in about 30 minutes in a crucible on a gas stove. The coarser the powder, the smaller the surface area, thus the less oxygen can react with the powder, and the less mass it can gain.
See Also
- Lee, Shao-Kuan; Hsu, Hsiu-Ching; Tuan, Wei-Hsing (2016) "Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation"
Materials Research 19(1)
DOI:10.1590/1980-5373-MR-2015-0139